Passive 1U rackmount CPU cooler from Dynatron® for Intel® LGA 1366 (Socket B) server processors. Constructed from copper for optimal heat transfer and sporting vapor chamber technology, the T307 supports a CPU with a TDP rating of 130W. Thermal compound is pre-printed with Shin-Etsu G751; no additional thermal compound is required.The T307 passive heatsink is designed to be used in conjunction with an active cooling system; the 1U case must have active cooling, e.g., fans.

What is a Vapor Chamber and how does that help me?
A vapor chamber is, in essence, a flattened heatpipe in direct contact to the CPU surface that transfers and dissipates heat more efficientlythan a traditional heatsink can manage. The vapor chamber is air tight, containing a coolant, and operates through a continuous cycle of evaporative cooling. What this provides you with is more effective cooling and CPU thermal protection with no additional bulk.

Noteable features include:

• Solid copper heatsink with stacked-fins
• Supports 1U+
• Pre-printed thermal compound
• RoHS Compliance